5 days old

Signal and Power Integrity Engineer (SK)

Folsom, CA 95630
Job ID: JR0217903
Job Category: Engineering
Primary Location: Folsom, CA US
Other Locations: US, California, Santa Clara
Job Type: Experienced Hire

Signal and Power Integrity Engineer (SK)

Job Description

This is an exciting time to be at Intel!  Come join Intel® 3D NAND Technology and Manufacturing (NAND-DTM)and work on one of the most advanced 3DNAND and SSD technology portfolios in the world.   As a global leader in the semiconductor industry, Intel possesses many industry leading SSD technologies including the most capable Quadruple Level Cell QLC Intel® 3D NAND Technology Flash products.   

Join our Non-volatile Memory Solutions Group working on NAND memory products as a Signal and Power Integrity Design engineer
Intel NAND-DTM (Design Technology Manufacturing) Group is looking for a self-driven Signal and Power Integrity Engineer. In this role you will be part of a dynamic team working on enabling the next generation NAND solutions for the Client and Data Center segments. As a Signal and Power Integrity Engineer you will be part of a larger multi-disciplinary team which includes members from Architecture, Circuit Design (I/O), Package Design, and Hardware/Board design. You will be responsible for generating IO, package, and board models to be used in multiple stages of the product design to enable an optimized Signal Integrity and Power-Integrity solution. In addition, lab based models will need to be extracted from measurements of Wafers and package substrates. You will also be the main point of contact for all component related interactions between Architecture, Circuit Design, Package
Design and Board Design, and among others.

Some roles and responsibilities include but are not limited to the following:

- Generate package and IO models to be used in System Level simulations
- Generate IO and IBIS models from Circuit Design Netlist
- Extract Package Models from layout and provide design recommendations for optimal SIPI performance
- Perform AC and DC Power Delivery Analysis to evaluate key PI metrics like IR drop, noise levels, and impedance profiles
- Perform SI pathfinding simulations to explore future design parameters
- Correlate lab measurements to system simulation results
- Define and update SIPI methodologies to fill gaps where needed

- Team player willing to be a technical lead in SI/PI domain to drive others to accomplish larger group goals.

The position is associated with the sale of the NAND business to SK Hynix aligning to Phase 2 of the transaction. Employees aligned to Phase 2 will continue to be employed by Intel developing NAND technology and components. Phase 2 of the transaction is expected to close in March 2025 at which time employees aligned to this phase of the transaction will transition employment to Solidigim, a stand-alone US subsidiary of SK Hynix headquartered in San Jose, California with offices worldwide. Solidigim is a leading global supplier of NAND flash memory solutions, led by Robert (Rob) B. Crooke as CEO, previously senior vice president and general manager of Intel's Non-Volatile Memory Solutions Group. To read more, see: https://www.intc.com/news-events/press-releases/detail/1513/intel-sells-ssd-business-and-dalian-facility-to-sk-hynix


Minimum Qualifications:
- BS/MS/PhD in Electrical Engineering or related field with 3-5+ Years of relevant experience
- Experience with Fundamentals of 2D/3D Electromagnetic Theory and Transmission Line Theory
- Experience in Full System Signal and Power Integrity Analyses
- Experience in statistical analyses like DOE
- Hands-on experience with EM Field solvers to extract interconnect models like PowerSI, Momentum, HFSS, Q3D, PolarSI, Q2D, etc
- Hands-on experience with System Level SI/PI simulators like ADS, SystemSI, Matlab, etc

Preferred Qualifications:
- MS in Electrical Engineering + 3 years or related field or /PhD in Electrical Engineering with 1+ Years of relevant experience
- Experience in SI/PI methodology development and improvements to established flows
- Experience in modeling Chip to Chip interconnects (i.e Die, Package, PCB)
- Hands-on experience with VNA and/or TDR lab equipment to extract measurements based on characteristics from Silicon wafers and package samples
- Experience in PCB and Package layout process

Inside this Business Group

Employees in Intel's NAND Product Group deliver solutions that are transforming computing across all segments from data centers to Ultrabooks. They invent, develop, bring to market and support customers with leading-edge NAND flash memory and system level solutions such as solid state drives (SSDs). SSDs are accelerating performance for gaming enthusiasts, reducing total cost of ownership for IT managers of data centers and improving security and reliability for businesses. This dynamic group is strategically positioned to become the leading Non-Volatile Memory solution supplier for the compute segment and is a key to expanding markets and continuing the growth for Intel.

Other Locations

US, California, Santa Clara

Intel strongly encourages employees to be vaccinated against COVID-19. Intel aligns to federal, state, and local laws and as a contractor to the U.S. Government is subject to government mandates that may be issued. Intel policies for COVID-19 including guidance about testing and vaccination are subject to change over time.

Posting Statement

All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.

Work Model for this Role

This role will require an on-site presence.

USExperienced HireJR0217903FolsomNAND Product Group


Posted: 2022-05-13 Expires: 2022-06-12

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Signal and Power Integrity Engineer (SK)

Folsom, CA 95630

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