1+ months

Physical Design Engineer

Intel
新竹市, HSZ 300
Job ID: JR0150450
Job Category: Engineering
Primary Location: Hsinchu, HSZ TW
Other Locations: Taiwan, Taipei
Job Type: Experienced Hire

Physical Design Engineer

Job Description
1. Responsible for physical design execution of IP/SoC designs to achieve best-in-class performance, power and area for leading edge technology 2. Performs all aspects of SoC design flow from physical synthesis, floorplan, place and route, timing and power optimization, EM/IR analysis and physical verification 3. Analyze, identify and drive key enablement capabilities for leading edge technology assessment to achieve best-in-class PPA results 4. Extensive knowledge in SoC and ARM CPU/GPU design, power efficiency, physical synthesis, timing analysis and verification flows


Qualifications

1. MS/BS degree in Electrical or Computer Engineering or relevant 2. 10+ years of experience in ASIC or ARM CPU/GPU design and solid analytical and problem solving skills 3. Hands on expertise in running leading edge (Synopsys/Cadence) physical design and sign-off tools 4. Experience with leading foundry technology is preferred

Inside this Business Group

As the world's largest chip manufacturer, Intel strives to make every facet of semiconductor manufacturing state-of-the-art -- from semiconductor process development and manufacturing, through yield improvement to packaging, final test and optimization, and world class Supply Chain and facilities support. Employees in the Technology and Manufacturing Group are part of a worldwide network of design, development, manufacturing, and assembly/test facilities, all focused on utilizing the power of Moore’s Law to bring smart, connected devices to every person on Earth



Other Locations

Taiwan, Taipei

TWExperienced HireJR0150450Hsinchu

Categories

Posted: 2020-11-23 Expires: 2021-03-20

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Physical Design Engineer

Intel
新竹市, HSZ 300

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