17 days old

Packaging R&D Engineer Undergrad Intern

Intel
Phoenix, AZ 85003
Job ID: JR0128592
Job Category: Intern/Student
Primary Location: Phoenix, AZ US
Other Locations:
Job Type: Intern

Packaging R&D Engineer Undergrad Intern

Job Description

  • Microelectronic Packaging Engineers provide project management, package design/development and sustaining support for integrated circuit or semiconductor assemblies, various other electronic components and/or completed units.
  • Responsible for the thermal/mechanical/electrical design, analysis, and development of electronic packages.
  • Defines overall package performance and specification and realizes technology certification through layout design and test vehicle design.
  • Conducts tests and research on basic materials and properties.
  • Establishes material specifications for contract assemblers and raw material vendors and interfaces with Quality Assurance and Purchasing regarding material quality and vendor performance.
  • Provides consultation concerning packaging problems and improvements in the packaging process.
  • Responds to customer/client requests or events as they occur.
  • Develops solutions to problems utilizing formal education and judgment.

The candidate should also exhibit the following behavioral traits or/and skills:

  • Self starter, with high level of initiative and independent learner
  • Developing problem solving skills and ability to work in team setting
  • Ability to communicate results clearly and concisely

This is an internship and compensation will be given accordingly based on candidate education level and internship duration.


Qualifications

This U.S. position is open to U.S. Workers Only.

A U.S. Worker is someone who is either a U.S. Citizen, U.S. National, U.S. Lawful Permanent Resident, or a person granted Refugee or Asylum status by the U.S. Government.

Intel will not sponsor a foreign national for this position.

You must possess the below requirements to be initially considered for this position.

Knowledge and/or experience listed below would be obtained through a combination of your school work/classes/research and/or relevant previous job and/or internship experiences.

Requirements

  • Pursuing a bachelor's degree program in a related science or engineering field: Electrical Engineering or Mechanical Engineering or Physics

3+ months of experience:

  • Familiarity with statistical and engineering analysis tools (JMP, Minitab, Excel, SQL Pathfinder, etc.)
  • Understanding of basic statistical concepts and engineering analysis methods
Inside this Business Group

As the world's largest chip manufacturer, Intel strives to make every facet of semiconductor manufacturing state-of-the-art -- from semiconductor process development and manufacturing, through yield improvement to packaging, final test and optimization, and world class Supply Chain and facilities support. Employees in the Technology and Manufacturing Group are part of a worldwide network of design, development, manufacturing, and assembly/test facilities, all focused on utilizing the power of Moore’s Law to bring smart, connected devices to every person on Earth



Posting Statement

All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance....

USInternJR0128592Phoenix

Categories

Posted: 2020-02-07 Expires: 2020-03-09

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Packaging R&D Engineer Undergrad Intern

Intel
Phoenix, AZ 85003

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