16 days old

Packaging R&D Engineer

Phoenix, AZ 85003
Job ID: JR0114351
Job Category: Engineering
Primary Location: Phoenix, AZ US
Other Locations:
Job Type: College Grad

Packaging R&D Engineer

Job Description

Package R&D Engineer provide project management, package design/development and sustaining support for integrated circuit or semiconductor assemblies, various other electronic components and/or completed units. Responsible for assembly and substrate defect/process characterization and identifying key mechanisms that contribute to RC identification. Conduct hands on lab work, define data acquisition strategy and data analysis plan, and recommend corrective actions/fixes to internal customers. Other duties may include failure analysis, developing innovative techniques/approaches to accelerate failure identification and mechanism understanding. Provides consultation concerning packaging/assembly problems and improvements in the manufacturing process. Responds to customer/client requests or events as they occur. Develops solutions to problems utilizing formal education and judgment.


Minimum Qualifications:
Possess a BS in Electrical Engineering, Materials Science and Engineering, Mechanical Engineering, Physics or other applied engineering degree with 3+ months of related experience.

Preferred Qualifications:
6 months or more of experience in in electrical test, fault isolation, failure analysis, quality & reliability (Q&R), or yield is a plus.
Detailed knowledge of some or all of the following is preferred: optical microscopy, electron microscopy, curve tracing, elite, and time domain reflectometry.

Inside this Business Group

As the world's largest chip manufacturer, Intel strives to make every facet of semiconductor manufacturing state-of-the-art -- from semiconductor process development and manufacturing, through yield improvement to packaging, final test and optimization, and world class Supply Chain and facilities support. Employees in the Technology and Manufacturing Group are part of a worldwide network of design, development, manufacturing, and assembly/test facilities, all focused on utilizing the power of Moore’s Law to bring smart, connected devices to every person on Earth

Posting Statement

All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance....

USCollege GradJR0114351


Posted: 2019-08-06 Expires: 2019-09-18

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Packaging R&D Engineer

Phoenix, AZ 85003

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