1+ months

Packaging R&D Engineer

Intel
Hillsboro, OR 97123
Job ID: JR0126440
Job Category: Engineering
Primary Location: Hillsboro, OR US
Other Locations:
Job Type: College Grad

Packaging R&D Engineer

Job Description

Join Intel and engineer the future.
Intel is in the midst of an exciting transformation, with a vision to create and extend computing technology to connect and enrich the lives of every person on Earth.

So join us-and help us create the next generation of technologies that will shape the future for decades to come.

Customer Platform Technology Development (CPTD), a group within Assembly Test Technology Development (ATTD), supports multiple business units' product assembly needs as well as the SMT manufacturing certification of new CPU, chipset, SoC package and socket technology.

  • The prototype factory in Hillsboro, Oregon, builds fully functional products including the SMT circuit board manufacturing, system assembly, and parametric, board, and system level test.
  • Beyond assembly, CPTD offers multiple areas of technology development expertise, board design, rework, design augmentation, and failure analysis service.

In this position, you will be a packaging R&D engineer in CPTD organization in Oregon.

  • CPTD organization specializes in process technology development for Printed Circuit Boards (PCBs) and Surface Mount Technology (SMT) processes.
  • In this role, you will be responsible for development of new process technologies to help advance Intel's PCB roadmap.
  • As a Packaging R&D Engineer at Intel, you will be responsible for development and validation of new PCB technologies to meet Intel's product demand.
  • Your responsibilities will include market intelligence across PCB Fabrication supply chain, supplier technology and capability, PCB evaluations and qualifications, PCB material and product qualifications, and defining manufacturable guidelines based on evaluation of PCB supplier capabilities

The candidate should also exhibit the following behavioral traits or/and skills:

  • Team building capability (written and verbal communication skills)


You will also be responsible for:

  • Partnering with a business unit and PCB suppliers to develop and validate new PCB technologies
  • Electrical design simulations to evaluate and recommend technology solutions that meet signal integrity and power delivery requirements
  • Interacting with PCB suppliers to deliver market intelligence on capability, capacity, and quality of new and existing suppliers across the PCB supply chain including: PCB fabrication, laminate materials, fabrication process equipment, and fabrication chemicals


What we offer you:

  • We give you opportunities to transform technology and create a better future, by delivering products that touch the lives of every person on earth.
  • As a global leader in innovation and new technology, we foster a collaborative, supportive, and boredom-free environment-where the brightest minds in the world come together to achieve exceptional results.
  • We offer a competitive salary and financial benefits such as bonuses, retirement plans, life and disability insurance, opportunities to buy Intel stock at a discounted rate, and Intel stock awards (eligibility at the discretion of Intel Corporation).
  • We provide benefits that promote a healthy, enjoyable life: excellent medical plans, wellness programs and amenities, flexible work hours, time off, recreational activities, discounts on various products and services, and many more creative perks that make Intel a Great Place to Work!


We're constantly working on making a more connected and intelligent future, and we need your help. Change tomorrow. Start today.

This is an entry level position and compensation will be given accordingly.


Qualifications

You must possess the below minimum qualifications to be initially considered for this position.

Preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates.

Knowledge and/or experience listed below would be obtained through a combination of your school work/classes/research and/or relevant previous job and/or internship experiences.

Minimum

  • Master's degree or PhD degree in Electrical Engineering or Materials Science or Chemical Engineering, or a related engineering field with 6 months experience
  • Working knowledge or experience in Printed Circuit Board (PCB) and Surface Mount Technology (SMT) Assembly processes
  • Knowledge of Impedance modeling of PCBs, Signal Integrity and Power delivery strategies for PCB designs
  • Ability to make technical decisions and provide technical direction

Preferred

  • Experience with simulation tools like HFSS, ADS or equivalent
  • Experience with high frequency electrical measurements - TDR, VNA

Inside this Business Group

As the world's largest chip manufacturer, Intel strives to make every facet of semiconductor manufacturing state-of-the-art -- from semiconductor process development and manufacturing, through yield improvement to packaging, final test and optimization, and world class Supply Chain and facilities support. Employees in the Technology and Manufacturing Group are part of a worldwide network of design, development, manufacturing, and assembly/test facilities, all focused on utilizing the power of Moore’s Law to bring smart, connected devices to every person on Earth



Posting Statement

All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance....

USCollege GradJR0126440Hillsboro

Categories

Posted: 2020-01-10 Expires: 2020-03-14

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Packaging R&D Engineer

Intel
Hillsboro, OR 97123

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