1+ months

GPE Datacenter - Datacenter Mechanical Design Engineer

Intel
台北市, TPE 110
Job ID: JR0159798
Job Category: Engineering
Primary Location: Taipei, TPE TW
Other Locations:
Job Type:

GPE Datacenter - Datacenter Mechanical Design Engineer

Job Description

Intel desires entry into market segments served by high performance discrete graphics. Participation in market segments served by discrete graphics requires the delivery of reference platforms to downstream customers with sufficient confidence in the design to ramp this design or very close derivative into high volume production quickly. Intel is building this capability and now seeks to create a discrete graphics Platform System Engineering team in Taiwan.  Are you interested?  Then GPE has an opportunity for you.  

In GPE, we are responsible for delivering leading GPU solutions to integrated and discrete graphics in data center and will continue to deliver a pipeline of innovation supporting the complete Intel platform, including CPU, memory, and accelerators! We are looking for a Mechanical Design engineer to join our team.

Key Responsibilities

The GPE Mechanical Designer, will drive the technical development, on time delivery and cost optimization of thermal mechanical solutions for products based on Intel's discrete graphics chips. In this role you will design, in collaboration with engineers from all competencies of the system engineering team (thermal, PCB layout, board design, power design, etc.), thermal mechanical solutions for graphics pcie cards and OAM modules, create product reference designs, and/or mobile graphics systems. You will drive all aspects of the mechanical design, from scoping/planning, 3D modelling, structural analysis, material selection, mechanical simulation, vendor engagement, layout review and more for all new designs. You will interact with the SoC design, board validation, quality and reliability, industrial design, marketing, program management or other associated teams that are integral to the launch of products. In addition, you may work with key OEM/ODM partners in support of their designs.

Required Background

This is a critical position within the Intel GPE development organization. The successful candidate will have demonstrated a successful track record of delivering high quality designs on time, working and influencing industry leaders, and engaging with OEMs and partners. The market segments served by discrete graphics are fast moving, therefore the successful candidate shall demonstrate a high level of comfort with change and change management.



Qualifications

Required Experience

  • 5+ years of experience delivering high performance thermal mechanical solutions for electronics applications (air cooled and liquid cooled)
  • Good working knowledge of 3D modelling software (Creo, SolidWorks) and database management (Windchill)
  • Good working knowledge of mechanical simulation software (Abaqus CAE, ANSYS Mechanical)
  • Experience delivering products to market for successful high-volume production
  • Knowledge of design for manufacturing and ease of assembly
  • Experience with manufacturing processes and implications to yield
  • Knowledge of finishing options and associated costs
  • Experience with cost optimization
  • Ability to drive manufacturers remotely to resolve technical issues or push for timely delivery
  • Awareness of thermal and electrical design principles and the impacts of mechanical changes on thermal and electrical design
  • Experience with the typical requirements of regulatory and compliance validation for consumer electronics
  • Ability and willingness for global travel to meet internal teams and with external customers

Desired Qualifications

  • Experience in the mechanical design of PCIe discrete graphics pcie add-in cards, OAM modules, discrete graphics systems or rack chassis
  • Experience with the PCIe Thermal Mechanical Specification and thermal mechanical test requirements of OEMs
  • Experience in the design of PCIe add in cards for server products and exposure to data center customers and usage models
  • Good working knowledge of thermal simulation software (ANSYS Icepak, Flotherm)
Inside this Business Group

Intel Architecture, Graphics, and Software (IAGS) brings Intel's technical strategy to life. We have embraced the new reality of competing at a product and solution level—not just a transistor one. We take pride in reshaping the status quo and thinking exponentially to achieve what's never been done before. We've also built a culture of continuous learning and persistent leadership that provides opportunities to practice until perfection and filter ambitious ideas into execution.

TWJR0159798Taipei

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Posted: 2021-02-26 Expires: 2021-04-16

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GPE Datacenter - Datacenter Mechanical Design Engineer

Intel
台北市, TPE 110

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