12 days old

Electronic Package Engineering Graduate Internship

Intel
新竹市, HSZ 300
Job ID: JR0114248
Job Category: Intern/Student
Primary Location: Hsinchu, HSZ TW
Other Locations:
Job Type: Intern

Electronic Package Engineering Graduate Internship

Job Description
The Non-Volatile Memory group in Hsinchu, Taiwan is looking for a paid intern to help support packaging research and development projects. This position will involve working with assembly site, Intel packaging team, planning, and electrical test groups.


Qualifications

Experience listed below would be obtained through a combination of your school work/classes/research and/or relevant previous job and/or internship experiences.

Minimum Qualifications:

- The candidate must be pursuing a Master or PHD degree in Materials Science, Mechanical Engineering, Metallurgical Engineering, Chemical Engineering, or related field.
- The candidate must have the unrestricted right to work in the Taiwan without requiring sponsorship.

Preferred Qualifications:

- 3+ months of experience in electronic materials processing.
- 3+ months of experience in IC fabrication process.
- 3+ months of experience in electronic packaging materials and/or assembly process.
- 3+ months of experience in fast paced environment.

Inside this Business Group

Non-Volatile Solutions Memory Group:  The Non-Volatile Memory Solutions Group is a worldwide organization that delivers NAND flash memory products for use in Solid State Drives (SSDs), portable memory storage devices, digital camera memory cards, and other devices.  The group is responsible for NVM technology design and development, complete Solid State Drive (SSD) system hardware and firmware development, as well as wafer and SSD manufacturing.

Categories

Posted: 2019-08-05 Expires: 2019-09-04

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Electronic Package Engineering Graduate Internship

Intel
新竹市, HSZ 300

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