18 days old

Die Prep Wafer Dicing Engineering

成都, 51
Job ID: JR0116771
Job Category: Engineering
Primary Location: Chengdu, 51 CN
Other Locations:
Job Type: Experienced Hire

Die Prep Wafer Dicing Engineering

Job Description
Working in Chengdu Die-Pre(DP) engineering group of Intel, team will provide you a great opportunity to learn the most advance semiconductor knowledge in the best working environment. As a member of DP engineering team, you would be engaged in the semiconductor devices backend manufacture process and the team will bring a wonderful journey for you on how silicon magically turns to individual chips as well-known CPU appearance. Besides, engineering team will support your career development in daily works, which will include but not be limited to: process and equipment management, electrical/ mechanical projects, new products introduction, etc. Your efforts, learnings and innovation ideas would be always recognized in DP engineering family, team will share meaningful engineering challenges with you, like as semiconductor failure modeling development, electrical/mechanical issue diagnosis, in-depth evaluation of variable factors and big data analysis, welcome to the truly engineering world!
If you are a person who has the passion to make a difference when facing challenges, pushing the mechanical limits and enjoys coming out of comfortable zone, Then Come And Join Us!


1. You have at least 3 Years of experience in Machine (Mechanics) maintenance, troubleshooting and design optimization; work experience on Silicon Blade Dicing tools will be preferred
2. Hold Bachelor or Master degree majoring in Mechanics, Mechatronics, Automation, and Electronic.
3. Good English communication skill on oral English and writing. English as first language in daily work.
Additional Requirements:
1. Having basic skill on Module Based Problem Solving, logic thinking and commonality data analysis.
2. Good communication skills, and optimistic / enthusiastic to the work, and good teamwork.
3. Good at managing projects and multiple tasks.

Inside this Business Group

As the world's largest chip manufacturer, Intel strives to make every facet of semiconductor manufacturing state-of-the-art -- from semiconductor process development and manufacturing, through yield improvement to packaging, final test and optimization, and world class Supply Chain and facilities support. Employees in the Technology and Manufacturing Group are part of a worldwide network of design, development, manufacturing, and assembly/test facilities, all focused on utilizing the power of Moore’s Law to bring smart, connected devices to every person on Earth

CNExperienced HireJR0116771Chengdu


Posted: 2019-09-04 Expires: 2019-10-12

Before you go...

Our free job seeker tools include alerts for new jobs, saving your favorites, optimized job matching, and more! Just enter your email below.

Share this job:

Die Prep Wafer Dicing Engineering

成都, 51

Join us to start saving your Favorite Jobs!

Sign In Create Account
Powered ByCareerCast